Electronic device
US-2024385660-A1 · Nov 21, 2024 · US
Systems and methods for improved window mounting on an electronic device
US9060418B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9060418-B2 |
| Application number | US-201213607530-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 7, 2012 |
| Priority date | Sep 7, 2012 |
| Publication date | Jun 16, 2015 |
| Grant date | Jun 16, 2015 |
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Abstract
Official abstract text for this publication.
Systems and methods for improved window mounting on electronic devices are provided. A window mounting assembly can include a heat activated adhesive, such as a heat activated film (“HAF”), which can be used to secure a window to an enclosure. In some embodiments, heated air can be blown in from a bottom side of the window, which can provide better offset control in the assembly. In some embodiments, an undercut can be made in the enclosure that can act as a trap for HAF overflow. An overhang that is created by the undercut can reduce the visibility of HAF overflow from a user. In addition, the heated air that is applied to the window can create a high pressure region in an area underneath the window. The high pressure region can direct the HAF overflow away from this area and towards the undercut in the enclosure.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for using a heat activated adhesive for mounting a window on an electronic device, the window comprising first, second, and third sides, the method comprising: applying the first side of the window to an enclosure, wherein the enclosure surrounds the window on at least a portion of the first side and the second side, and at least the portion of the first side comprises the heat activated adhesive; applying the third side of the window to an unmovi…
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Classifications
- G06F1/1656Primary
Physics · mapped topic
- H05K5/0017Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9060418B2 cover?
- Systems and methods for improved window mounting on electronic devices are provided. A window mounting assembly can include a heat activated adhesive, such as a heat activated film (“HAF”), which can be used to secure a window to an enclosure. In some embodiments, heated air can be blown in from a bottom side of the window, which can provide better offset control in the assembly. In some embodi…
- Who is the assignee on this patent?
- Shukla Ashutosh Y, Louchard Thomas R, Yan Vincent, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification G06F1/1656. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jun 16 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).