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Land grid array (LGA) socket cartridge and method of forming
US9059552B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9059552-B2 |
| Application number | US-201313745965-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 21, 2013 |
| Priority date | Jan 21, 2013 |
| Publication date | Jun 16, 2015 |
| Grant date | Jun 16, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Aspects of the present invention relate to land grid array socket cartridge structures. In one embodiment, a land grid array (LGA) cartridge structure includes: a deformable thin film having at least one aperture configured to hold a substantially liquid metal, whereby in a compressed state of the deformable thin film, the substantially liquid metal of the deformable thin film is configured to electro-mechanically couple a carrier and a socket base. Another embodiment includes a method of forming a LGA cartridge structure. The method includes: providing a deformable thin film having a first surface and a second surface, and forming at least one aperture within the deformable thin film through the first surface and the second surface, wherein the aperture is configured to hold a substantially liquid metal.
First claim
Opening claim text (preview).
What is claimed is: 1. A land grid array (LGA) cartridge structure comprising: a deformable thin film having at least one aperture configured to hold a substantially liquid metal, whereby in a compressed state of the deformable thin film, the substantially liquid metal of the deformable thin film is configured to electro-mechanically couple a carrier and a socket base; and at least one substantially rigid structure surrounding the at least one aperture of the deformable thin fil…
Assignees
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Classifications
- H01R43/00Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
- H01R12/714Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9059552B2 cover?
- Aspects of the present invention relate to land grid array socket cartridge structures. In one embodiment, a land grid array (LGA) cartridge structure includes: a deformable thin film having at least one aperture configured to hold a substantially liquid metal, whereby in a compressed state of the deformable thin film, the substantially liquid metal of the deformable thin film is configured to …
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H01R43/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 16 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).