60 GHz integrated circuit to printed circuit board transitions

Patent metadata

Field	Value
Publication number	US-9059490-B2
Application number	US-201314048603-A
Country	US
Kind code	B2
Filing date	Oct 8, 2013
Priority date	Oct 8, 2013
Publication date	Jun 16, 2015
Grant date	Jun 16, 2015

Abstract

Embodiments are directed to a transition structure for interfacing an integrated circuit chip and a substrate, comprising: a co-planar waveguide (CPW) structure formed based on ground-signal-ground (GSG) pads on the integrated circuit chip, a grounded co-planar waveguide (CPWG) structure coupled to the GSG pads, and a microstrip coupled to the CPWG structure.

First claim

What is claimed is:

1. A transition structure for interfacing an integrated circuit chip and a substrate, comprising:
a vertical transmission section configured to bridge two layers of a package between two ground planes;
a transmission line formed between the ground planes and connected to a center of the vertical transmission section;
a second vertical transmission section coupled to the transmission line and a layer of the package;
a plurality of solder connections coupled to the layer of the package; and
a microstrip coupled to at least one of the solder connections.

2. The transition structure of claim 1 , wherein the microstrip is coupled to the at least one of the solder connections through a grounded co-planar waveguide structure.

3. The transition structure of claim 1 , wherein the transmission line comprises a stripline.

4. The transition structure of claim 1 , wherein at least one of the vertical transmission section and the second vertical transmission section comprises a quasi-coax section.

5. The transition structure of claim 1 , wherein the substrate comprises a printed circuit board.

6. The transition structure of claim 1 , wherein the transmission line is configured to convey a signal associated with the integrated circuit.

7. The transition structure of claim 6 , wherein the signal is a millimeter wave signal.

8. The transition structure of claim 6 , wherein the at least one solder connection is associated with the signal, and wherein the remainder of the solder connections are associated with a ground.

9. The transition structure of claim 1 , further comprising:
a via configured to provide a direct current path to ground.

10. The transition structure of claim 1 , wherein the chip comprises ground-signal-ground pads that create a co-planar waveguide structure that is continued in a second layer of the package.

11. The transition structure of claim 10 , further comprising vias between the second layer and a third layer of the package.

12. The transition structure of claim 1 , wherein the microstrip is tapered.

13. The transition structure of claim 1 , wherein the package is a low temperature co-fired ceramic package.

Assignees

• Blackberry Ltd

Inventors

• Devries Christopher Andrew
• Kanj Houssam
• Repeta Morris
• Gu Huanhuan

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/073

  of die-attach connectors · CPC title