Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US9057952B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9057952-B2 |
| Application number | US-201213345978-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 9, 2012 |
| Priority date | Jul 26, 2005 |
| Publication date | Jun 16, 2015 |
| Grant date | Jun 16, 2015 |
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Official abstract text for this publication.
A positive resist composition comprising: (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid; (B) a compound which generates an acid upon irradiation with actinic rays or a radiation; (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z); and (F) a solvent, and a method of pattern formation with the composition: (x) an alkali-soluble group; (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution; and (z) a group which decomposes by an action of an acid.
Opening claim text (preview).
What is claimed is: 1. A positive resist composition comprising: (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid and which has no fluorine atom; (B) a compound which generates an acid upon irradiation with actinic rays or a radiation; (C) a fluorine-containing compound having a molecular weight of 1,000 to 100,000 and containing (y) a group which decomposes by an action of an alkaline developing solution to enha…
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