Piezoelectric device and electronic apparatus

US9054604B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9054604-B2
Application numberUS-201313906683-A
CountryUS
Kind codeB2
Filing dateMay 31, 2013
Priority dateMar 11, 2011
Publication dateJun 9, 2015
Grant dateJun 9, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.

First claim

Opening claim text (preview).

What is claimed is: 1. An oscillation equipment comprising: a vibration device including a package, the package containing an insulating substrate and a lid; a vibration element installed in the package; an oscillation circuit that drives the vibration element; a temperature compensation circuit that supplies a signal to the oscillation circuit for compensating temperature characteristics; a temperature sensor installed in the package that outputs analog temperature inform…

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What does patent US9054604B2 cover?
A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the t…
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification H03B5/32. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 09 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).