Method for manufacturing substrate for semiconductor light emitting element and semiconductor light emitting element using the same

US9054271B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9054271-B2
Application numberUS-201414152765-A
CountryUS
Kind codeB2
Filing dateJan 10, 2014
Priority dateDec 21, 2006
Publication dateJun 9, 2015
Grant dateJun 9, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10 . The first main surface of the substrate 10 has substrate protrusion portion 11 , the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor light emitting element, comprising: a substrate comprising at least one protrusion having a top surface and a bottom portion on a main surface of the substrate, and in cross-sections of the substrate, the bottom portion of the protrusion having a width greater than a width of the top surface of the protrusion, or in a top view of the substrate, an outline of the top surface being at an inner side of an outline of the bottom portion of the…

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What does patent US9054271B2 cover?
A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10 . The first main surface of the substrate 10 has substrate protrusion portion 11 , the bottom surface 14 of each protrusion is wider than the top surface 13 …
Who is the assignee on this patent?
Nichia Corp
What technology area does this patent fall under?
Primary CPC classification H10H20/814. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 09 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).