Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9054262B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9054262-B2 |
| Application number | US-201414216296-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 17, 2014 |
| Priority date | Sep 29, 2009 |
| Publication date | Jun 9, 2015 |
| Grant date | Jun 9, 2015 |
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Integrated upconversion devices capable of upconverting incident visible to short wavelength infrared photons to visible photons are disclosed. The device may include a quantum dot-based photodiode and a light-emitting diode. The device may further include a gain element such as a thin-film transistor.
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What is claimed is: 1. An upconversion device, comprising: a thin-film photodiode (PD) comprising a PD cathode, a PD anode, and a PD active region between the PD anode and the PD cathode, wherein at least one of the PD cathode and the PD anode is transparent to incident photons in the short-wavelength infrared (SWIR) or SWIR-visible range, and the PD active region comprises a quantum dot (QD) layer and is configured for outputting an electrical signal in response to receiving the…
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