Assembling thin silicon chips on a contact lens

Patent metadata

Field	Value
Publication number	US-9054079-B2
Application number	US-201314025581-A
Country	US
Kind code	B2
Filing date	Sep 12, 2013
Priority date	Sep 26, 2012
Publication date	Jun 9, 2015
Grant date	Jun 9, 2015

Abstract

A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.

First claim

What is claimed is:

1. A method for manufacturing a contact lens having an integrated circuit, comprising:
creating a plurality of chip contact pads on a chip by forming a plurality of metal lines on a surface of the chip;
applying assembly bonding material to each of a plurality of lens contact pads formed on a lens substrate;
bonding the plurality of chip contact pads to the plurality of lens contact pads via the assembly bonding material to bond the chip to the lens substrate;
cutting the lens substrate into a ring shape; and
embedding the lens substrate cut into the ring shape and the chip bonded thereon into a contact lens material to form the contact lens.

2. The method of claim 1 , wherein the forming the plurality of metal lines comprises forming the plurality of metal lines using photolithography.

3. The method of claim 1 , further comprising, prior to the embedding, sealing the chip on the lens substrate.

4. The method of claim 1 , further comprising, prior to the embedding, molding the lens substrate to match a curvature of an eye over which the contact lens is to be worn.

5. The method of claim 1 , wherein the chip has a thickness of about 100 microns or less and a length of about 1.0 millimeter or less.

6. The method of claim 1 , wherein the contact lens material includes at least one of a hydrogel, a silicone hydrogel or a silicone elastomer.

7. The method of claim 1 , wherein the bonding is performed employing a flip-chip bonder.

8. A contact lens having an integrated circuit disposed thereon or therein formed by a process comprising the steps of:
creating a plurality of chip contact pads on a chip by forming a plurality of metal lines on a surface of the chip;
applying assembly bonding material to each of the plurality of chip contact pads;
bonding the plurality of the chip contact pads to a plurality of lens contact pads formed on a lens substrate via the assembly bonding material to bond the chip to the lens substrate;
cutting the lens substrate into a ring shape; and
embedding the lens substrate cut into the ring shape and the chip bonded thereon into a contact lens material to form the contact lens.

9. The contact lens of claim 8 , wherein the step of forming the plurality of metal lines comprises forming the plurality of metal lines using photolithography.

10. The contact lens of claim 8 , wherein the process further comprises the step of, prior to the embedding, sealing the chip on the lens substrate.

11. The contact lens of claim 8 , wherein the process further comprises the step of, prior to the embedding, molding the lens substrate to match a curvature of an eye over which the contact lens is to be worn.

12. The contact lens of claim 8 , wherein the chip has a thickness of about 100 microns or less and a length of about 1.0 millimeter or less.

13. The contact lens of claim 8 , wherein the bonding is performed employing a flip-chip bonder.

14. The contact lens of claim 8 , wherein the contact lens material includes at least one of a hydrogel, a silicone hydrogel or a silicone elastomer.

15. A method for manufacturing a contact lens having an integrated circuit, comprising:
creating a plurality of lens contact pads on a lens substrate;
creating a plurality of chip contact pads on a chip;
applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads;
aligning the plurality of lens contact pads with the plurality of chip contact pads;
bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding; and
forming a contact lens with the lens substrate, wherein the forming the contact lens with the lens substrate comprises cutting the lens substrate into a ring shape.

16. The method of claim 15 , wherein the creating the plurality of the lens contact pads comprises forming a plurality of metal lines on the lens substrate using photolithography.

17. The method of claim 15 , wherein the creating the plurality of the lens contact pads comprises forming a plurality of metal squares having a length of about 100 microns or less.

18. The method of claim 15 , wherein the creating the plurality of the chip contact pads comprises forming a plurality of metal lines on the chip using photolithography.

19. The method of claim 15 , wherein the forming the contact lens further comprises:
sealing the chip on the lens substrate;
molding the lens substrate to match a curvature of an eye over which the contact lens is to be worn; and
embedding the lens substrate into a hydrogel.

20. The method of claim 15 , wherein the chip has a thickness of about 100 microns or less and a length of about 1.0 millimeter or less.

21. The method of claim 15 , wherein the bonding the chip to the lens substrate via the assembly bonding material comprises employing pressure and heat at a temperature of 200° C. or less.

Assignees

• Google Inc

Inventors

• Etzkorn James

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/922

  Bond pads being integral with underlying chip-level interconnections · CPC title

• H10W70/654

  Top-view layouts · CPC title