Using temperature margin to balance performance with power allocation

Patent metadata

Field	Value
Publication number	US-9052885-B2
Application number	US-201213723276-A
Country	US
Kind code	B2
Filing date	Dec 21, 2012
Priority date	Dec 21, 2012
Publication date	Jun 9, 2015
Grant date	Jun 9, 2015

Abstract

A method and apparatus using temperature margin to balance performance with power allocation. Nominal, middle and high power levels are determined for compute elements. A set of temperature thresholds are determined that drive the power allocation of the compute elements towards a balanced temperature profile. For a given workload, temperature differentials are determined for each of the compute elements relative the other compute elements, where the temperature differentials correspond to workload utilization of the compute element. If temperature overhead is available, and a compute element is below a temperature threshold, then particular compute elements are allocated power to match or drive toward the balanced temperature profile.

First claim

What is claimed is:

1. A power management system, comprising:
at least one temperature sensor configured to sense temperatures of at least two types of compute elements;
a microcontroller configured to determine temperature differentials for each of the compute elements relative to the other compute elements; and
the microcontroller configured to allocate power to certain compute elements if a temperature differential is below a predetermined temperature threshold for a compute element, where the power allocation drives toward a balanced temperature profile for the compute elements, wherein the balanced temperature profile includes different temperature profiles corresponding to the at least two types of compute elements and reflects optimal performance for each compute element.

2. The power management system of claim 1 , wherein the temperature differentials correspond to workload utilizations of the compute elements.

3. The power management system of claim 1 , wherein the predetermined temperature thresholds drive the power allocation of the compute elements towards a balanced temperature profile.

4. The power management system of claim 1 , wherein the compute elements share a cooling system.

5. The power management system of claim 1 , wherein the power allocation is made if the certain compute elements have a temperature overhead.

6. The power management system of claim 1 , wherein the predetermined temperature thresholds correspond to a power level between a nominal power level and a maximum power level.

7. A device, comprising:
a plurality of compute elements including at least two types of compute elements;
at least one temperature sensor configured to sense temperatures of the plurality of compute elements;
a microcontroller configured to determine temperature differentials between the plurality of compute elements; and
the microcontroller configured to allocate power to at least one compute element if a temperature differential is below a predetermined temperature threshold for another compute element, where the power allocation moves the plurality of compute elements to a balanced temperature profile, wherein the balanced temperature profile includes different temperature profiles corresponding to the at least two types of compute elements and reflects optimal performance for each compute element.

8. The device of claim 1 , wherein the temperature differentials correspond to workload utilizations of the compute elements.

9. The device of claim 1 , wherein the predetermined temperature thresholds drive the power allocation of the plurality of compute elements towards a balanced temperature profile.

10. The device of claim 1 , wherein the plurality of compute elements share a cooling system.

11. The device of claim 1 , wherein the power allocation is made if the at least one compute element has a temperature overhead.

12. The device of claim 1 , wherein the predetermined temperature thresholds correspond to a power level between a nominal power level and a maximum power level.

13. A method for power allocation, comprising:
sensing temperatures of compute elements of at least two types;
determining temperature differentials between the compute elements; and
allocating power to a compute element if a temperature differential is below a predetermined temperature threshold for another compute element, where the power allocation moves the compute elements to a balanced temperature profile, wherein the balanced temperature profile includes different temperature profiles corresponding to the at least two types of compute elements and reflects optimal performance for each compute element.

14. The method of claim 13 , wherein the temperature differentials correspond to workload utilizations of the compute elements.

15. The method of claim 13 , wherein the predetermined temperature thresholds drive the power allocation of the compute elements towards a balanced temperature profile.

16. The method of claim 13 , wherein the compute elements share a cooling system.

17. The method of claim 13 , wherein the power allocation is made if the compute element has a temperature overhead.

18. The method of claim 13 , wherein the predetermined temperature thresholds correspond to a power level between a nominal power level and a maximum power level.

19. The method of claim 13 , wherein the predetermined temperature threshold levels are set below a maximum temperature to indicate less than full utilization of a compute element and ensure sufficient temperature headroom for the other compute elements to increase performance with the additional power allocated to the compute elements at the expense of the underutilized compute element.

20. The method of claim 13 , further comprising:
determining a set of temperature thresholds that correspond to a balanced temperature profile.

21. A computer readable non-transitory medium including instructions which when executed in a processing system cause the processing system to execute a method for power allocation, the method comprising:
sensing temperatures of compute elements of at least two types;
determining temperature differentials between the compute elements; and
allocating power to a compute element if a temperature differential is below a predetermined temperature threshold for another compute element, where the power allocation moves the compute elements to a balanced temperature profile, wherein the balanced temperature profile includes different temperature profiles corresponding to the at least two types of compute elements and reflects optimal performance for each compute element.

Assignees

• Advanced Micro Devices Inc

Inventors

• Naffziger Samuel D
• Osborn Michael
• Nussbaum Sebastien

Classifications

• G06F1/206

  comprising thermal management · CPC title

• G06F1/26 Primary

  Power supply means, e.g. regulation thereof (for memories G11C) · CPC title