System for transfer of nanomembrane elements with improved preservation of spatial integrity
US-2015375488-A1 · Dec 31, 2015 · US
Imprint method
US9050752B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9050752-B2 |
| Application number | US-201314083592-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 19, 2013 |
| Priority date | Nov 20, 2012 |
| Publication date | Jun 9, 2015 |
| Grant date | Jun 9, 2015 |
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Abstract
Official abstract text for this publication.
An imprint method according to this embodiment includes preparing a mold having a recessed portion, filling the recessed portion with a mold non-reactive material, pressing the mold against a resist which is applied on a base material, curing the resist in a state that the mold is pressed, and separating the mold from the base material. The mold non-reactive material is a material which does not chemically react with a material of the mold. By curing of the resist, the resist and the mold non-reactive material are coupled. When the mold is separated from the base material, the resist and the mold non-reactive material are left on the base material.
First claim
Opening claim text (preview).
What is claimed is: 1. An imprint method, comprising: preparing a mold having a recessed portion; at least partly filling the recessed portion with a mold non-reactive material which does not chemically react with a material of the mold; pressing the mold against a resist, the resist being applied on a base material; curing the resist in a state that the mold is pressed to cause coupling of the resist and the mold non-reactive material and to form a recessed portion and a pr…
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Classifications
- B29C59/026Primary
Operations & Transport · mapped topic
- G03F7/0002Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US9050752B2 cover?
- An imprint method according to this embodiment includes preparing a mold having a recessed portion, filling the recessed portion with a mold non-reactive material, pressing the mold against a resist which is applied on a base material, curing the resist in a state that the mold is pressed, and separating the mold from the base material. The mold non-reactive material is a material which does no…
- Who is the assignee on this patent?
- Toshiba Kk
- What technology area does this patent fall under?
- Primary CPC classification B29C59/026. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 09 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).