Automatic handling apparatus
US-2017190019-A1 · Jul 6, 2017 · US
Manufacturing method of carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing method of wafer
US9050698B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9050698-B2 |
| Application number | US-201013379482-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 18, 2010 |
| Priority date | Jul 21, 2009 |
| Publication date | Jun 9, 2015 |
| Grant date | Jun 9, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A manufacturing method of a carrier for a double-side polishing apparatus for polishing surfaces of a wafer, the carrier having: a carrier body arranged between upper and lower turn tables, the carrier body having a holding hole for holding the wafer; and a ring-shaped resin insert arranged along an inner circumference of the holding hole, the resin insert having an inner circumferential surface to be brought into contact with a peripheral portion of the wafer to be held, the method having the steps of attaching, to the holding hole of the carrier body, a base material for the resin insert not having the inner circumferential surface to be brought into contact with the wafer to be held, and performing inner-circumferential-surface-forming processing on the base material for the resin insert to form the inner circumferential surface to be brought into contact with the peripheral portion of the wafer to be held.
First claim
Opening claim text (preview).
The invention claimed is: 1. A manufacturing method of a carrier for a double-side polishing apparatus for polishing both surfaces of a wafer, the carrier comprising: a carrier body configured to be arranged between upper and lower turn tables that each have a polishing pad attached thereto; a holding hole disposed in the carrier body and configured to hold the wafer such that the wafer is sandwiched between the upper and lower turn tables during polishing of the wafer; and a…
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Cross-Sectional Technologies · mapped topic
- B24B37/28Primary
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9050698B2 cover?
- A manufacturing method of a carrier for a double-side polishing apparatus for polishing surfaces of a wafer, the carrier having: a carrier body arranged between upper and lower turn tables, the carrier body having a holding hole for holding the wafer; and a ring-shaped resin insert arranged along an inner circumference of the holding hole, the resin insert having an inner circumferential surfac…
- Who is the assignee on this patent?
- Yasuda Taichi, Enomoto Tatsuo, Shinetsu Handotai Kk
- What technology area does this patent fall under?
- Primary CPC classification B24B37/28. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 09 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).