Apparatus and method for manufacturing double-sided mounting substrate

US9049809B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9049809-B2
Application numberUS-201213718186-A
CountryUS
Kind codeB2
Filing dateDec 18, 2012
Priority dateDec 26, 2011
Publication dateJun 2, 2015
Grant dateJun 2, 2015

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is an apparatus for manufacturing a double-sided mounting substrate, the apparatus including: a backup table provided under the printed circuit board at the mounting position which supports the lower surface of the printed circuit board; and a servo motor which elevates and lowers the backup table, wherein the servo motor elevates the backup table to mount the new electronic components and lowers the backup table to carry-in and to carry-away the printed circuit board based on a lower limit position of the backup table, and wherein the lower limit position of the backup table is a position separated downwardly from a reference surface at the mounting position by a distance obtained by adding a preset clearance to a sum of a maximum height of the mounted electronic components mounted on the lower surface of the printed circuit board and a thickness of the printed circuit board.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for manufacturing a double-sided mounting substrate, in which a printed circuit board with mounted electronic components mounted on upper and lower surfaces of the printed circuit board is carried to a mounting position, new electronic components are mounted on the upper surface of the printed circuit board at the mounting position, and the printed circuit board is carried away from the mounting position after the new electronic components are mo…

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Frequently asked questions

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What does patent US9049809B2 cover?
Provided is an apparatus for manufacturing a double-sided mounting substrate, the apparatus including: a backup table provided under the printed circuit board at the mounting position which supports the lower surface of the printed circuit board; and a servo motor which elevates and lowers the backup table, wherein the servo motor elevates the backup table to mount the new electronic components…
Who is the assignee on this patent?
Samsung Techwin Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K13/04. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 02 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).