Modular liquid cooling for multi-node computing systems
US-2024389276-A1 · Nov 21, 2024 · US
US9049802B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9049802-B2 |
| Application number | US-201213674958-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 13, 2012 |
| Priority date | Mar 15, 2012 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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An apparatus includes a server cabinet configured to receive a plurality of servers therein, and a single heat dissipation device mounted on the server cabinet and positioned outside of the plurality of servers. The heat dissipation device includes a plurality of fans, and each of the plurality of fans is configured to dissipate heat generated in the overall server cabinet.
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a server cabinet capable of receiving a plurality of servers therein; and a heat dissipation device mounted on the server cabinet; wherein the heat dissipation device includes a plurality of fans and a housing, the housing defining a plurality of heat dissipation holes corresponding to the plurality of fans, a diameter of each heat dissipation hole equal to or greater than a sum of thicknesses of all of the servers, each heat dis…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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