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Integrated drive-motor assembly with IP seal and enhanced heat transfer
US9048708B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9048708-B2 |
| Application number | US-201213668833-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 5, 2012 |
| Priority date | Nov 5, 2012 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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- Title
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Abstract
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An electronics drive module is connected to the flange of a drive motor assembly. The module includes: a metal frame including a peripheral wall; and a metal floor. A power supply PCBA is located adjacent the upper surface of the metal floor, and a switching chip assembly is located adjacent the lower surface of the floor. The base plate of the switching chip assembly conducts heat into the floor and conducts heat into the mounting flange. An environmental seal is located between the lower edge of the frame and the sealing surface of the mounting flange and extending coextensively with the lower edge of the peripheral wall such that a sealing zone is defined within the peripheral wall of the frame and the first and second thermal interfaces are located within the sealing zone.
First claim
Opening claim text (preview).
The invention claimed is: 1. An integrated drive motor assembly comprising: a motor comprising a motor housing and a motor unit located in the motor housing, said motor housing comprising a mounting flange including a sealing surface and a peripheral edge; an electronics drive module connected to said mounting flange of said motor housing, said electronics drive module comprising: (i) a metal frame comprising a peripheral wall that defines a central opening and that includes an…
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- What does patent US9048708B2 cover?
- An electronics drive module is connected to the flange of a drive motor assembly. The module includes: a metal frame including a peripheral wall; and a metal floor. A power supply PCBA is located adjacent the upper surface of the metal floor, and a switching chip assembly is located adjacent the lower surface of the floor. The base plate of the switching chip assembly conducts heat into the flo…
- Who is the assignee on this patent?
- Cloran Shawn D, Vrankovic Zoran, Risty Corey J, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H02K5/10. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 02 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).