Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9048629B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9048629-B2 |
| Application number | US-201313925324-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 24, 2013 |
| Priority date | Jul 31, 2011 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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A semiconductor device is provided that has a VCSEL and a protection diode integrated therein and that has an additional intrinsic layer. The inclusion of the additional intrinsic layer increases the width of the depletion region of the protection diode, which reduces the amount of capacitance that is introduced by the protection diode. Reducing the amount of capacitance that is introduced by the protection diode allows the VCSEL to operate at higher speeds.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a substrate; a first plurality of layers comprising a semiconductor material disposed on top of the substrate, wherein a first, lower distributed Bragg reflector (DBR) is formed in the first plurality of layers, and wherein at least one of the first plurality of layers is of the first type of semiconductor material; at least a first intrinsic layer containing a light-emitting material disposed on top of the lower DBR, s…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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