Antenna circuit

US9048525B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9048525-B2
Application numberUS-91825709-A
CountryUS
Kind codeB2
Filing dateFeb 17, 2009
Priority dateFeb 20, 2008
Publication dateJun 2, 2015
Grant dateJun 2, 2015

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An antenna circuit which includes a substrate and a planar circuit with a circuit line of a conductive material formed on a surface of the substrate, and at least one conductive pad (notch-forming part) electrically connected with the circuit line of the planar circuit. Cutting lines, such as perforations, are provided in the substrate around an outer periphery of the notch-forming part and extend into the notch-forming part on either side of connection points where the circuit line connects with the notch-forming part, The cutting lines approach each other in the notch-forming part to form a section (notch port). The antenna circuit can be destroyed even if an IC tag provided with the antenna circuit is peeled off from various directions, and the destruction rate of the circuit can be increased stably.

First claim

Opening claim text (preview).

The invention claimed is: 1. An antenna circuit which comprises a substrate and a planar circuit comprising a circuit line of a conductive material extending laterally on a surface of the substrate and at least one conductive pad also extending laterally on the surface of the substrate and electrically connected with the circuit line of the planar circuit at at least one electrical connection point, wherein cutting lines are provided in the substrate laterally beyond and around an outer periphery of the conductive pad, wherein the cutting lines extend laterally into the conductive pad from the outer periphery of the conductive pad such that the cutting lines bracket the at least one connection point without traversing either the circuit lines or the connection point, and the cutting lines approach each other in the conductive pad while maintaining electrical connection within the pad, and wherein the cutting lines extending into the conductive pad form straight lines which approach each other and define a section angle of greater than 10 degrees and less than 120 degrees. 2. The antenna circuit as claimed in claim 1 , wherein the cutting lines are perforated cutting lines of alternating joints and slits. 3. The antenna circuit as claimed in claim 1 , further comprising an integrated circuit chip electrically connected to the planar circuit. 4. The antenna circuit as claimed in claim 1 , further comprising at least one pressure-sensitive adhesive layer laminated on the surface of the substrate on which the planar circuit is formed. 5. The antenna circuit as claimed in claim 4 , wherein pressure-sensitive adhesive layers are formed on both surfaces of the substrate on which the planar circuit is formed, and further comprising a protecting sheet laminated on a surface of at least one of the pressure-sensitive adhesive layers, wherein an adhesive strength of the pressure-sensitive adhesive layer contacted to the protecting sheet in an area laterally within the cutting line is smaller than an adhesive strength of the pressure-sensitive adhesive layer contacted to an adherend in an area laterally outside the cutting line. 6. The antenna circuit as claimed in claim 4 , wherein pressure-sensitive adhesive layers are formed on both surfaces of the substrate on which the planar circuit is formed, and further comprising a protecting sheet laminated on a surface of at least one of the pressure-sensitive adhesive layers, wherein an adhesive strength of the pressure-sensitive adhesive layer contacted to the protecting sheet is smaller than an adhesive strength of the pressure-sensitive adhesive layer contacted to an adherend. 7. The antenna circuit as claimed in claim 2 , further comprising an integrated circuit chip electrically connected to the planar circuit. 8. The antenna circuit as claimed in claim 2 , further comprising at least one pressure-sensitive adhesive layer laminated on the surface of the substrate on which the planar circuit is formed. 9. The antenna circuit as claimed in claim 3 , further comprising at least one pressure-sensitive adhesive layer laminated on the surface of the substrate on which the planar circuit is formed. 10. The antenna circuit as claimed in claim 7 , further comprising at least one pressure-sensitive adhesive layer laminated on the surface of the substrate on which the planar circuit is formed. 11. An antenna circuit which comprises a substrate and a planar circuit comprising a circuit line of a conductive material extending laterally on a surface of the substrate and at least one conductive pad also extending laterally on the surface of the substrate and electrically connected with the circuit line of the planar circuit at at least one electrical connection point, wherein cutting lines are provided in the substrate laterally beyond an outer periphery of the conductive pad, wherein the cutting lines are electrically non-conductive and extend laterally into the conductive pad from the outer periphery of the conductive pad such that the cutting lines bracket the at least one connection point without traversing either the circuit lines or the connection point, and the cutting lines approach each other in the conductive pad while maintaining electrical connection within the pad. 12. The antenna circuit as claimed in claim 11 , wherein the cutting lines comprise perforations, each perforation extending from the surface of the substrate into the substrate. 13. The antenna circuit as claimed in claim 12 , wherein the cutting lines comprise slits, each slit extending from the surface of the substrate into the substrate.

Assignees

Inventors

Classifications

  • formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

  • the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

  • with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering · CPC title

  • Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

  • H01Q7/00Primary

    Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

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Frequently asked questions

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What does patent US9048525B2 cover?
An antenna circuit which includes a substrate and a planar circuit with a circuit line of a conductive material formed on a surface of the substrate, and at least one conductive pad (notch-forming part) electrically connected with the circuit line of the planar circuit. Cutting lines, such as perforations, are provided in the substrate around an outer periphery of the notch-forming part and ext…
Who is the assignee on this patent?
Matsushita Taiga, Katakura Katsumi, Murakami Takakazu, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01Q7/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 02 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).