Thermal disturb as heater in cross-point memory
US-2015380111-A1 · Dec 31, 2015 · US
US9048422B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9048422-B2 |
| Application number | US-201414269107-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 3, 2014 |
| Priority date | Dec 14, 2010 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.
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What is claimed is: 1. A method of fabricating a non-volatile storage apparatus, the method comprising: adding one or more driver devices and signal lines to a substrate; adding a select layer above the substrate and above the one or more driver devices and the signal lines, the adding of the select layer including adding select lines and adding asymmetrical vertically oriented select devices; and adding a monolithic three dimensional array above the select layer, the monolith…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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