Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Package with integrated pre-match circuit and harmonic suppression
US9048232B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9048232-B2 |
| Application number | US-201213459879-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 30, 2012 |
| Priority date | Apr 30, 2012 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.
First claim
Opening claim text (preview).
What is claimed is: 1. A package having an integrated pre-match circuit, comprising: a connection at a first side of said package to a printed circuit board; a die fixed to said package on a second side opposite to said first side; and said integrated pre-match circuit constituting an impedance match for a signal sent to a circuit external to said package, wherein said signal has a predetermined main frequency component, said pre-match circuit comprising: a pair of transmissi…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9048232B2 cover?
- A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a p…
- Who is the assignee on this patent?
- Colussi Laurentius Cornelis, Willms Johannes Geradus, Dialog Semiconductor Bv
- What technology area does this patent fall under?
- Primary CPC classification H10W70/685. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 02 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).