Pvt-method and device for producing single crystals in a safe manner with regard to the process
US-2024376633-A1 · Nov 14, 2024 · US
US9048166B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9048166-B2 |
| Application number | US-201313769977-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 19, 2013 |
| Priority date | Apr 28, 2010 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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A method for controlled growth of silicon carbide and structures produced by the method are disclosed. A crystal of silicon carbide (SiC) can be grown by placing a sacrificial substrate in a growth zone with a source material. The source material may include a low-solubility impurity. SiC is then grown on the sacrificial substrate to condition the source material. The sacrificial substrate is then replaced with the final substrate, and SiC is grown on the final substrate. A single crystal of silicon carbide is produced, wherein the crystal of silicon carbide has substantially few micropipe defects. Such a crystal may also include a substantially uniform concentration of the low-solubility impurity, and may be used to make wafers and/or SiC die.
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The invention claimed is: 1. A silicon carbide crystal having a substantially uniform concentration of a low-solubility impurity, a substantially uniform ration from about 1 to about 3 of the low-solubility impurity to second impurity, a dimension of at least 50 mm, and a plurality of geometric volumes, each a volume of 100 mm 3 with less than or equal to 5 micropipes the silicon carbide crystal formed by a process comprising: placing a sacrificial substrate in a chamber with a s…
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