Semiconductor device and high frequency switch
US-2024321773-A1 · Sep 26, 2024 · US
US9048136B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9048136-B2 |
| Application number | US-201113282261-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 26, 2011 |
| Priority date | Oct 26, 2011 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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A static random access memory cell is provided formed in a silicon layer over a buried oxide layer on a substrate and including first and second inverters each having a pull-up and pull-down transistor configured to form a cell node. Each of the pull-down transistors of the first and second inverters are formed over first regions below the buried oxide layer with the first regions having a first doping level forming first backgates for the pull-down transistors. A pair of passgate transistors respectively couples to the cell nodes of the first and second inverters and each are formed over second regions below the buried oxide layer with the second regions having a second doping level forming second backgates for the passgate transistors. Active bias circuitry applies potentials to the first and second backgates during read, standby and write operations of the static random access memory cell.
Opening claim text (preview).
What is claimed is: 1. A static random access memory cell formed in a silicon layer over an insulating layer on a substrate and including first and second inverters each having a pull-up and pull-down transistor configured to form a cell node, comprising: each of the pull-down transistors of the first and second inverters being formed in a silicon layer and over first regions below the insulating layer, the first regions having a first doping level forming first backgates for the…
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