Semiconductor arrangement and formation thereof
US-2015375992-A1 · Dec 31, 2015 · US
US9045331B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9045331-B2 |
| Application number | US-201313864623-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 17, 2013 |
| Priority date | Apr 17, 2012 |
| Publication date | Jun 2, 2015 |
| Grant date | Jun 2, 2015 |
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Official abstract text for this publication.
A micromechanical component having a control element is described, which is connected via at least one supply line spring having a supply line spring constant to a mounting support in an adjustable manner, and a drive device having at least one actuator component situated on the control element. Via at least one line component guided over the at least one supply line spring an electric potential or a current signal is able to be provided to the actuator component in such a way that the control element is able to be set by the drive device into a motion with respect to the mounting support. The control element is additionally connected to the mounting support, and the supply line spring constant is less than vibratory spring constant. Also described is a method for producing a micromechanical component.
Opening claim text (preview).
What is claimed is: 1. A micromechanical component, comprising: at least one supply line spring having a supply line spring constant; a mounting support; a control element connected via the at least one supply line spring to the mounting support in an adjustable manner; at least one line component guided via the at least one supply line spring; at least one lineless vibratory spring having a vibratory spring constant; and a drive device including at least one actuator co…
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