Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US9040992B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9040992-B2 |
| Application number | US-201313870732-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 25, 2013 |
| Priority date | Apr 26, 2012 |
| Publication date | May 26, 2015 |
| Grant date | May 26, 2015 |
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A display device includes a laminated wiring formed of a low-resistance conductive film, and a low-reflection film mainly containing Al and functioning as an antireflective film which are sequentially arranged on a transparent substrate, a wiring terminal part provided at an end part of the laminated wiring and has the same laminated structure as that of the laminated wiring, and an insulating film for covering the laminated wiring and the wiring terminal part, in which the insulating film side serves as a display surface side, the wiring terminal part has a first opening part penetrating the insulating film and the low-reflection film and reaching the low-resistance conductive film, and an outer peripheral portion of the first opening part has a laminated structure of the low-resistance conductive film, the low-reflection film, and the insulating film, in at least one part.
Opening claim text (preview).
What is claimed is: 1. A display device comprising: a laminated wiring comprising a conductive film, and an antireflective film sequentially arranged on a base layer; a wiring terminal part provided at an end part of said laminated wiring and having a same laminated structure as that of said laminated wiring; and an insulating film for covering said laminated wiring and said wiring terminal part, in which said insulating film side serves as a display surface side, wherein sa…
Electricity · mapped topic
Physics · mapped topic
Electricity · mapped topic
Physics · mapped topic
Physics · mapped topic
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