Method of fabricating seminconductor devices including self aligned refractory contacts

Patent metadata

Field	Value
Publication number	US-9040398-B2
Application number	US-43485306-A
Country	US
Kind code	B2
Filing date	May 16, 2006
Priority date	May 16, 2006
Publication date	May 26, 2015
Grant date	May 26, 2015

Abstract

Methods of forming semiconductor devices are provided by forming a semiconductor layer on a semiconductor substrate. A mask is formed on the semiconductor layer. Ions having a first conductivity type are implanted into the semiconductor layer according to the mask to form implanted regions on the semiconductor layer. Metal layers are formed on the implanted regions according to the mask. The implanted regions and the metal layers are annealed in a single step to respectively activate the implanted ions in the implanted regions and provide ohmic contacts on the implanted regions. Related devices are also provided.

First claim

That which is claimed is:

1. A method of forming a semiconductor device, the method comprising:
providing a semiconductor layer;
forming a mask on the semiconductor layer;
implanting ions having a first conductivity type into the semiconductor layer according to the mask to form implanted regions on the semiconductor layer;
forming metal layers on the implanted regions according to the mask; and
annealing the implanted regions and the metal layers in a single step to respectively activate the implanted ions in the implanted regions and provide ohmic contacts on the implanted regions,
wherein the semiconductor device comprises a Group III-nitride semiconductor device.

2. The method of claim 1 :
wherein providing the semiconductor layer comprises:
forming a channel layer on the semiconductor substrate;
forming a barrier layer on the channel layer; and
forming a protective layer on the barrier layer; and
wherein forming the mask comprises forming the mask on the protective layer.

3. The method of claim 2 :
wherein implanting ions is preceded by etching the protective layer according to the mask to expose at least a portion of a surface of the barrier layer; and
wherein implanting ions further comprising implanting ions having the first conductivity type into the barrier layer according to the mask to form implanted regions on the barrier layer.

4. The method of claim 3 , wherein the implanted regions extend at least partially into the channel layer.

5. The method of claim 2 , wherein implanting ions comprises implanting ions having the first conductivity type into the protective layer and the barrier layer according to the mask to form implanted regions in the protective layer and the barrier layer, the method further comprising:
etching the protective layer according to the mask to expose at least a portion of the implanted regions of the barrier layer.

6. The method of claim 5 , wherein the implanted regions extend at least partially into the channel layer.

7. The method of claim 2 , wherein the protective layer comprises a high purity nitrogen (HPN) layer.

8. The method of claim 7 , wherein the HPN layer has a thickness of from about 50 to about 150 nm.

9. The method of claim 7 , wherein the HPN layer comprises a layer of HPN having a thickness of from about 50 to about 150 nm and a silicon dioxide (SiO 2 ) layer on the HPN layer having a thickness of from about 100 to about 250 nm.

10. The method of claim 1 , wherein the ohmic contacts include at least one refractory metal.

11. The method of claim 10 , wherein the refractory metal includes Ti, TiW, Mo, Ta, W, WSi, Re, Nb, TiWN, NiSi and/or TiSi.

12. The method of claim 1 , wherein the ohmic contacts are self-aligned to the implanted regions.

13. The method of claim 1 , wherein the first conductivity type comprises an n-type conductivity.

14. The method of claim 13 , wherein implanting ions comprising implanting silicon ions.

15. The method of claim 1 , wherein annealing comprises annealing the implanted regions and the metal layer at a temperature of at least about 950° C.

16. A method of forming a Group III-nitride semiconductor device, the method comprising:
providing a semiconductor layer;
selectively implanting ions into the semiconductor layer to provide highly doped implanted regions in the semiconductor layer;
forming a refractory metal layer on the highly doped implanted regions in the semiconductor layer, wherein the highly doped implanted regions and refractory metal layer are both formed using a single mask; and
annealing the highly doped implanted regions and the refractory metal layer in a single step to respectively activate the implanted ions of the highly doped implanted regions and form ohmic contacts that are self-aligned to the implanted regions on the implanted regions,
wherein providing the semiconductor layer comprises:
forming a channel layer on the semiconductor substrate;
forming a barrier layer on the channel layer; and
forming a protective layer on the barrier layer.

17. The method of claim 16 , further comprising forming a mask on the protective layer, wherein selectively implanting comprises selectively implanting ions into the semiconductor layer according to the mask and wherein forming a refractory metal layer further comprises forming a refractory metal layer on the highly doped implanted regions in the semiconductor layer according to the mask.

18. The method of claim 17 :
wherein selectively implanting ions is preceded by etching the protective layer according to the mask to expose at least a portion of a surface of the barrier layer; and
wherein selectively implanting ions further comprises selectively implanting ions having the first conductivity type into the barrier layer according to the mask to form implanted regions on the barrier layer.

19. The method of claim 18 , wherein the implanted regions extend at least partially into the channel layer.

20. The method of claim 17 , wherein selectively implanting ions comprises selectively implanting ions having the first conductivity type into the protective layer and the barrier layer according to the mask to form implanted regions in the protective layer and the barrier layer, the method further comprising:
etching the protective layer according to the mask to expose at least a portion of the implanted regions of the barrier layer.

21. The method of claim 20 , wherein the implanted regions extend at least partially into the channel layer.

22. The method of claim 16 , wherein the protective layer comprises a high purity nitrogen (HPN) layer.

23. The method of claim 22 , wherein the HPN layer has a thickness of from about 50 to about 150 nm.

24. The method of claim 22 , wherein the HPN layer comprises a layer of HPN having a thickness of from about 50 to about 150 nm and a silicon dioxide (SiO 2 ) layer on the HPN layer having a thickness of from about 100 to about 250 nm.

25. The method of claim 16 , wherein the refractory metal includes Ti, TiW, Mo, Ta, W, WSi, Re, Nb, TiWN, NiSi and/or TiSi.

26. The method of claim 16 , wherein the implanted ions comprise n-type conductivity ions.

27. The method of claim 26 , wherein the n-type conductivity ions comprise silicon ions.

28. The method of claim 16 , wherein annealing comprises annealing the implanted regions and the refractory metal layer at a temperature of at least about 950° C.

29. The method of claim 1 :
wherein providing the semiconductor layer comprises forming a protective layer; and
wherein implanting the ions is preceded by etching the protective layer according to the mask.

30. A method of forming a semiconductor device, the method comprising:
providing a semiconductor layer;
providing a protective layer on the semiconductor layer;
providing a single mask on the protective layer;
etching the protective layer according to the mask;
implanting ions having a first conductivity type into the semiconductor layer according to the mask to form implanted regions on the semiconductor layer; and
providing metal layers on the implanted regions according to the mask.

31. The method of claim 30 , further comprising annealing the implanted regions and the metal layers in a single step to respectively activate the implanted ions in the implanted regions and provide o

Assignees

• Saxler Adam William
• Sheppard Scott
• Cree Inc

Inventors

• Saxler Adam William
• Sheppard Scott

Classifications

• H10P95/904

  of Group III-V semiconductors · CPC title

• H10P10/00 Primary

  Bonding of wafers, substrates or parts of devices · CPC title

• H10D62/8503

  Nitride Group III-V materials, e.g. AlN or GaN · CPC title

• H10D30/015

  of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT · CPC title

• H10D30/4755 Primary

  having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs · CPC title