PatentsDB

Sensor package and method of forming same

US9040355B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9040355-B2
Application numberUS-201213546902-A
CountryUS
Kind codeB2
Filing dateJul 11, 2012
Priority dateJul 11, 2012
Publication dateMay 26, 2015
Grant dateMay 26, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method ( 70 ) of forming sensor packages ( 20 ) entails providing a sensor wafer ( 74 ) having sensors ( 30 ) formed on a side ( 26 ) positioned within areas ( 34 ) delineated by bonding perimeters ( 36 ), and providing a controller wafer ( 82 ) having control circuitry ( 42 ) at one side ( 38 ) and bonding perimeters ( 46 ) on an opposing side ( 40 ). The bonding perimeters ( 46 ) of the controller wafer ( 82 ) are bonded to corresponding bonding perimeters ( 36 ) of the sensor wafer ( 74 ) to form a stacked wafer structure ( 48 ) in which the control circuitry ( 42 ) faces outwardly. The controller wafer ( 82 ) is sawn to reveal bond pads ( 32 ) on the sensor wafer ( 74 ) which are wire bonded to corresponding bond pads ( 44 ) formed on the same side ( 38 ) of the wafer ( 82 ) as the control circuitry ( 42 ). The structure ( 48 ) is encapsulated in packaging material ( 62 ) and is singulated to produce the sensor packages ( 20 ).

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming sensor packages comprising: providing a sensor wafer having a first side and a second side opposite said first side, said first side including sensors positioned within areas on said first side delineated by first bonding perimeters, and said sensor wafer including first bond pads formed on said first side outside of said areas delineated by said first bonding perimeters; providing a controller wafer having a third side and a fourth sid…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

View patent family 48747334

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Get alerts for this patentView on Google Patents

Request deeper analysis

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9040355B2 cover?
A method ( 70 ) of forming sensor packages ( 20 ) entails providing a sensor wafer ( 74 ) having sensors ( 30 ) formed on a side ( 26 ) positioned within areas ( 34 ) delineated by bonding perimeters ( 36 ), and providing a controller wafer ( 82 ) having control circuitry ( 42 ) at one side ( 38 ) and bonding perimeters ( 46 ) on an opposing side ( 40 ). The bonding perimeters ( 46 ) of the con…
Who is the assignee on this patent?
Bowles Philip H, Holm Paige M, Hooper Stephen R, and 2 more
What technology area does this patent fall under?
Primary CPC classification B81C1/0023. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 26 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).