Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Stretchable electronic device and method of manufacturing same
US9040337B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9040337-B2 |
| Application number | US-201313840299-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2013 |
| Priority date | Oct 17, 2012 |
| Publication date | May 26, 2015 |
| Grant date | May 26, 2015 |
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Abstract
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Provided are a stretchable electronic device and a method of manufacturing the same. The manufacturing method includes forming coil interconnection on a first substrate, forming a first stretchable insulating layer that covers the coil interconnection, forming a second substrate on the first stretchable insulating layer, separating the first substrate from the coiling interconnection and the first stretchable insulating layer, and forming a transistor on the coil interconnection.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a stretchable electronic device, the method comprising: forming coil interconnections on a first substrate; forming a first stretchable insulating layer that covers the coil interconnection; forming a second substrate on the first stretchable insulating layer; separating the first substrate from the coiling interconnection and the first stretchable insulating layer; and forming a transistor on the coil interconnection.…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W70/60Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9040337B2 cover?
- Provided are a stretchable electronic device and a method of manufacturing the same. The manufacturing method includes forming coil interconnection on a first substrate, forming a first stretchable insulating layer that covers the coil interconnection, forming a second substrate on the first stretchable insulating layer, separating the first substrate from the coiling interconnection and the fi…
- Who is the assignee on this patent?
- Korea Electronics Telecomm
- What technology area does this patent fall under?
- Primary CPC classification H10W70/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 26 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).