Preparation method for dry film solder resist and film laminate used therein
US-2015366070-A1 · Dec 17, 2015 · US
US9035191B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9035191-B2 |
| Application number | US-201313826771-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2013 |
| Priority date | Dec 4, 2012 |
| Publication date | May 19, 2015 |
| Grant date | May 19, 2015 |
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Disclosed herein are a printed circuit board, including: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer, and a method for manufacturing the same.
Opening claim text (preview).
What is claimed is: 1. A printed circuit board, comprising: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer and, via an open area formed by the resist pattern, to partially expose the substrate's remaining surface area on which the circuit layer is not formed, wherein a width of a part of the resist pattern covering an up…
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