Printed circuit board and method for manufacturing the same

US9035191B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9035191-B2
Application numberUS-201313826771-A
CountryUS
Kind codeB2
Filing dateMar 14, 2013
Priority dateDec 4, 2012
Publication dateMay 19, 2015
Grant dateMay 19, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Disclosed herein are a printed circuit board, including: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer, and a method for manufacturing the same.

First claim

Opening claim text (preview).

What is claimed is: 1. A printed circuit board, comprising: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer and, via an open area formed by the resist pattern, to partially expose the substrate's remaining surface area on which the circuit layer is not formed, wherein a width of a part of the resist pattern covering an up…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9035191B2 cover?
Disclosed herein are a printed circuit board, including: a substrate having a patterned circuit layer on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer, wherein a width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern coveri…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H05K3/281. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 19 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).