Resin composition containing copolymerized polyester resin

US9034988B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9034988-B2
Application numberUS-201113813904-A
CountryUS
Kind codeB2
Filing dateAug 3, 2011
Priority dateAug 4, 2010
Publication dateMay 19, 2015
Grant dateMay 19, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin composition includes a copolymerized polyester resin, which exhibits excellent flexibility at room temperature, improvement in problems of brittleness, and excellent adhesiveness and moist-heat durability. The invention relates to a resin composition containing a copolymerized polyester resin which contains, as an acid component, an aromatic dicarboxylic acid and a dimer acid and, as a glycol component 1,4-butane diol and polybutadiene glycols, with the content of the dimer acid being 10 to 50 mol % in the acid component, the content of the 1,4-butane diol being 50 mol % or greater in the glycol component, and the content of the polybutadiene glycols being 0.5 to 20 mol % in the glycol component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition comprising a copolymerized polyester resin which contains, as an acid component, an aromatic dicarboxylic acid and a dimer acid and, as a glycol component 1,4-butane diol and polybutadiene glycol, with the content of the dimer acid being 10 to 50 mol % in the acid component, the content of the 1,4-butane diol being 80 to 98 mol % in the glycol component, and the content of the polybutadiene glycol being 2 to 20 mol % in the glycol component. 2. The resin composition according to claim 1 , wherein an organic phosphorus compound having two or more ester forming functional groups is copolymerized in the copolymerized polyester resin and the content of phosphorus atoms in the resin is between 500 and 20000 ppm by mass. 3. The resin composition according to claim 1 , wherein Young's modulus at 20° C. is 100 MPa or less. 4. The resin composition according to claim 1 , wherein Shore D hardness at 20° C. is 50 or less. 5. The resin composition according to claim 1 , wherein an oxygen index according to a combustion test is 27 or more. 6. A method for producing a resin molded article, the method comprising a step of molding the resin composition according to claim 1 at a pressure of 5 MPa or less to obtain the resin molded article. 7. The method according to claim 6 , wherein the step is carried out by injecting the resin composition according to claim 1 into a mold, in which an industrial component is disposed in advance to obtain the resin molded article having the industrial component. 8. The method according to claim 6 , wherein the step is carried out by injecting or adding dropwise the resin composition according to claim 1 to a housing or a substrate in which an industrial component is disposed in advance to obtain resin molded article having the industrial component. 9. The resin composition according to claim 1 , wherein a melting point of the copolymerized polyester resin is from 115 to 180° C.

Assignees

Inventors

Classifications

  • C08G63/54Primary

    the acids or hydroxy compounds containing carbocyclic rings · CPC title

  • Dicarboxylic acids and dihydroxy compounds · CPC title

  • C08F136/14Primary

    containing elements other than carbon and hydrogen · CPC title

  • Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title

  • C08G63/52Primary

    Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation · CPC title

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What does patent US9034988B2 cover?
A resin composition includes a copolymerized polyester resin, which exhibits excellent flexibility at room temperature, improvement in problems of brittleness, and excellent adhesiveness and moist-heat durability. The invention relates to a resin composition containing a copolymerized polyester resin which contains, as an acid component, an aromatic dicarboxylic acid and a dimer acid and, as a …
Who is the assignee on this patent?
Tomizawa Motoki, Okochi Takao, Tanaka Tomoki, and 4 more
What technology area does this patent fall under?
Primary CPC classification C08G63/54. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 19 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).