Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Apparatus and methods for quad flat no lead packaging
US9034697B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9034697-B2 |
| Application number | US-201113182710-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 14, 2011 |
| Priority date | Jul 14, 2011 |
| Publication date | May 19, 2015 |
| Grant date | May 19, 2015 |
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- Title
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Abstract
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A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for fabricating a semiconductor package, the method comprising: providing a supply of lead elements; mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame; connecting other components on the lead frame to the lead elements; providing a supply of other components that is accessible by a component placement system; and operating the component placement system to ret…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9034697B2 cover?
- A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements.
- Who is the assignee on this patent?
- Gong Zhiwei, Xu Jianwen, Gao Wei, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W74/019. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 19 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).