N-shot antenna assembly and related manufacturing method

Patent metadata

Field	Value
Publication number	US-9030372-B2
Application number	US-201213413427-A
Country	US
Kind code	B2
Filing date	Mar 6, 2012
Priority date	Sep 26, 2011
Publication date	May 12, 2015
Grant date	May 12, 2015

Abstract

An antenna module and a manufacturing method for the same are disclosed. With the miniaturization trend for mobile communication terminals, the invention can achieve the miniaturization of antenna modules and facilitate the design of the antenna. The SMD as a matching component for given resonance frequency and impedance matching of the antenna is mounted on the antenna module to make the antenna module compact, and functions as a matching circuit for impedance matching to facilitate the design of mobile devices.

First claim

What is claimed is:

1. An antenna assembly for use in wireless devices, comprising:
a carrier formed of non-conductive and plating-resistive resin material, and having one or more voids disposed on an outer surface thereof;
plating-friendly filler material spanning a volume created by the voids on the outer surface of the carrier;
conductive material disposed on a plated surface of the filler material forming a conductive pattern;
a plating resist disposed on the filler material forming a discontinuous part of the conductive pattern; and
at least one surface mounted device attached to the conductive pattern at said discontinuous part.

2. The antenna assembly of claim 1 , further comprising a solder mask having open areas in a portion for receiving the surface mounted device, wherein an input/output terminal of the surface mounted device is electrically connected with conductive patterns through a solder bumper in an open area of the solder mask where the conductive patterns are exposed for providing electrical continuity to the conductive patterns.

3. The antenna assembly of claim 1 , said antenna assembly comprising multiple layers;
a first of said layers comprising:
a first carrier formed of non-conductive and plating-resistive resin material, and having one or more first voids disposed on an outer surface thereof;
a first plating-friendly filler material spanning a volume created by the first voids on the outer surface of the first carrier;
first conductive material disposed on a plated surface of the first filler material forming a first conductive pattern;
a first plating resist disposed on the first filler material forming a first discontinuous part of the first conductive pattern; and
a first surface mounted device attached to the first conductive pattern at said first discontinuous part; and

a second of said layers comprising:
a second carrier formed of non-conductive and plating-resistive resin material, and having one or more second voids disposed on an outer surface thereof;
a second plating-friendly filler material spanning a volume created by the second voids on the outer surface of the second carrier;
second conductive material disposed on a plated surface of the second filler material forming a second conductive pattern;
a second plating resist disposed on the second filler material forming a second discontinuous part of the second conductive pattern; and

a second surface mounted device attached to the second conductive pattern at said second discontinuous part.

4. The antenna assembly of claim 3 , the first layer of said multiple layers having a first dielectric constant, and the second layer having a second dielectric constant, wherein the second dielectric constant is distinct from the first dielectric constant.

5. The antenna assembly of claim 1 , wherein a flexible circuit comprising one or more conductive traces is attached to the antenna assembly for providing one or more of: voltage, current, and control signals to components attached to the antenna assembly.

6. A method of manufacturing an antenna assembly for use in a wireless device, comprising the steps of:
using a first plating-resistive and non-conductive material to form a first carrier having one or more first voids on an outer surface thereof;
filling a volume of the first voids with a first plating-friendly filler material;
on the first filler material, attaching one or more first plating resists adapted to resist conductive plating;
forming first conductive patterns by plating a first conductive material on the plating-friendly first filler material, wherein each of the first plating resists forms a first discontinuous part of the conductive patterns; and
attaching at least one first surface mounted device to the first conductive patterns at one of the first discontinuous parts; and
using a second plating-resistive and non-conductive material to form a second carrier having one or more second voids on an outer surface thereof;
filling a volume of the second voids with a second plating-friendly filler material;
on the second filler material, attaching one or more second plating resists adapted to resist conductive plating;
forming second conductive patterns by plating a second conductive material on the plating-friendly second filler material, wherein each of the second plating resists forms a second discontinuous part of the conductive patterns; and
attaching at least one second surface mounted device to the second conductive patterns at one of the second discontinuous parts.

7. The method of claim 6 , wherein said attaching the surface mounted device comprises:
aligning terminal ends of the surface mounted device on the conductive pattern and interposing a solder bump therebetween; and
passing through a reflow oven having a temperature sufficient to melt the solder bump to connect the terminal ends of the surface mounted device with the conductive pattern through the solder bump.

8. The antenna assembly of claim 3 comprising three or more layers.

9. The antenna assembly of claim 3 , wherein at least a portion of the second conductive pattern is connected with the first conductive pattern of the first layer.

10. The antenna assembly of claim 8 , wherein at least one of said three or more layers comprises a laser directed structure.

11. The antenna assembly of claim 10 , wherein said laser directed structure is positioned above the first layer.

12. The antenna assembly of claim 10 , wherein said laser directed structure is positioned below the first layer.

13. The antenna assembly of claim 3 , at least one of said first and second layers comprising one or more parasitic conductors disposed thereon.

14. The antenna assembly of claim 1 ,
the plating resist being disposed on the filler material at one of: a feed portion or a ground portion of the conductive pattern;
wherein the surface mounted device comprises one of: a capacitor, inductor, resistor, diode, active component, switch, or a combination thereof.

15. The antenna assembly of claim 1 ,
the plating resist being disposed on the filler material at one of a plurality of radiating portions of the conductive pattern;
wherein the surface mounted device comprises: an active component or a switch.

16. The antenna assembly of claim 1 , further comprising a second surface mounted device disposed at a second discontinuous part being formed at one of a plurality of radiating portions of the conductor pattern, wherein said second surface mounted device comprises one of: a capacitor, inductor, resistor, diode, active component, switch, or a combination thereof.

17. The antenna assembly of claim 1 , comprising:
a first plating resist being disposed on the filler material at a feed portion of the conductive pattern, the first plating resist forming a first discontinuous part of the conductive pattern, wherein a first surface mounted device is disposed thereon;
a second plating resist being disposed on the filler material at a ground portion of the conductive pattern, the second plating resist forming a second discontinuous part of the conductive pattern, wherein a second surface mounted device is disposed thereon; and
a third plating resist being disposed on the filler material at a feed portion of the conductive pattern; the third plating resist forming a third discontinuous part of the conductive pattern, wherein a third surface mounted device is disposed thereon.

18. An antenna assembly for use in wireless devices, comprising:
a first layer including:
a first carrier formed of n

Assignees

• Desclos Laurent
• Shamblin Jeffrey
• Jeong Seong-Gi
• Choi Seung-Woong
• Seol Cheol-Hun
• Lee Won-Sui
• Ethertronics Inc

Inventors

• Desclos Laurent
• Shamblin Jeffrey
• Jeong Seong-Gi
• Choi Seung-Woong
• Seol Cheol-Hun
• Lee Won-Sui

Classifications

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q5/0058

  Electricity · mapped topic

• H01Q13/08

  Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines · CPC title

• H01Q5/371

  Branching current paths · CPC title

• H01Q1/24 Primary

  with receiving set · CPC title