Power module and electrical device
US-2024235414-A1 · Jul 11, 2024 · US
Semiconductor device including semiconductor chip mounted on lead frame
US9029993B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9029993-B2 |
| Application number | US-201314091507-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 27, 2013 |
| Priority date | Oct 30, 2008 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A semiconductor device includes a lead frame, a semiconductor chip, a substrate, a plurality of chip parts, a plurality of wires, and a resin member. The lead frame includes a chip mounted section and a plurality of lead sections. The semiconductor chip is mounted on the chip mounted section. The substrate is mounted on the chip mounted section. The chip parts are mounted on the substrate. Each of the chip parts has a first end portion and a second end portion in one direction, and each of the chip parts has a first electrode at the first end portion and a second electrode at the second end portion. Each of the wires couples the second electrode of one of the chip parts and one of the lead sections. The resin member covers the lead frame, the semiconductor chip, the substrate, the chip parts, and the wires.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a lead frame including a chip mounted section and a plurality of lead sections, the chip mounted section having a surface; a semiconductor chip mounted on the surface of the chip mounted section; a plurality of chip parts mounted on the surface of the chip mounted section, each of the plurality of chip parts having a first end portion and a second end portion in a direction parallel to the surface of the chip mounted se…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9029993B2 cover?
- A semiconductor device includes a lead frame, a semiconductor chip, a substrate, a plurality of chip parts, a plurality of wires, and a resin member. The lead frame includes a chip mounted section and a plurality of lead sections. The semiconductor chip is mounted on the chip mounted section. The substrate is mounted on the chip mounted section. The chip parts are mounted on the substrate. Each…
- Who is the assignee on this patent?
- Denso Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/475. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).