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Optoelectronic semiconductor device comprising a semiconductor chip, a carrier substrate and a film
US9029902B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9029902-B2 |
| Application number | US-201113880768-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 27, 2011 |
| Priority date | Oct 28, 2010 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor device includes a radiation-emitting semiconductor chip, a carrier substrate and a film. The carrier substrate has electrically conductive contact tracks on a top side. The film is arranged on a radiation exit side of the chip, the radiation exit side being remote from the carrier substrate, and on the top side of the carrier substrate and has electrically conductive first conductor tracks. The film has perforations arranged such that the semiconductor chip can be electrically contact-connected to the first contact track of the carrier substrate via the first conductor track of the film.
First claim
Opening claim text (preview).
The invention claimed is: 1. An optoelectronic semiconductor device comprising a semiconductor chip, a carrier substrate and a foil, wherein the semiconductor chip has an active layer that generates radiation, the carrier substrate has a first electrically conductive contact track and a second electrically conductive contact track on a top side, the semiconductor chip is arranged on the top side of the carrier substrate, the foil is arranged at least in regions on a radiatio…
Assignees
Inventors
Classifications
- H10H20/857Primary
Electricity · mapped topic
Electricity · mapped topic
- H01L33/62Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9029902B2 cover?
- A semiconductor device includes a radiation-emitting semiconductor chip, a carrier substrate and a film. The carrier substrate has electrically conductive contact tracks on a top side. The film is arranged on a radiation exit side of the chip, the radiation exit side being remote from the carrier substrate, and on the top side of the carrier substrate and has electrically conductive first condu…
- Who is the assignee on this patent?
- Ahlstedt Magnus, Ramchen Johann, Osram Opto Semiconductors Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10H20/857. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).