Printed circuit board and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9029708-B2
Application number	US-201113086449-A
Country	US
Kind code	B2
Filing date	Apr 14, 2011
Priority date	Apr 26, 2010
Publication date	May 12, 2015
Grant date	May 12, 2015

Abstract

A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

First claim

We claim:

1. A printed circuit board comprising:
a metal support substrate;
a base insulating layer formed on said metal support substrate;
first and second wiring patterns formed on said base insulating layer and constituting a signal line pair;
a cover insulating layer formed on said base insulating layer to cover at least part of said first and second wiring patterns; and
a ground layer provided on said cover insulating layer to be positioned above said first and second…

Assignees

• Oosawa Tetsuya
• Honjo Mitsuru
• Yamauchi Daisuke
• Nitto Denko Corp

Inventors

• Oosawa Tetsuya
• Honjo Mitsuru
• Yamauchi Daisuke

Classifications

• H05K1/0251

  Electricity · mapped topic

• H05K1/056 Primary

  Electricity · mapped topic

• H05K1/0245

  Electricity · mapped topic

• Y10T29/49155

  Cross-Sectional Technologies · mapped topic