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US-9223221-B2 · Dec 29, 2015 · US
Methods of patterning block copolymer layers
US9029271B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9029271-B2 |
| Application number | US-201314139986-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 24, 2013 |
| Priority date | Dec 31, 2012 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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Abstract
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A method of patterning a block copolymer layer includes: providing a guide pattern on a surface of a substrate, the guide pattern including sidewalls each elongated in a longitudinal direction and spaced apart from each other, a trench defined by a bottom surface and facing surfaces of the sidewalls, and having a uniform width over an entire length thereof in the longitudinal direction, and a latitudinal wall perpendicular to the longitudinal direction of the trench; providing a block copolymer layer on the surface of the substrate; and annealing the block copolymer to cause self-assembly of the block copolymer and to direct the same in the trench. The block copolymer has a microphase-separation into anisotropic discrete domains aligned with a period λ o in the trench by the annealing.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of patterning a block copolymer layer, comprising: providing a guide pattern on a surface of a substrate, in a plan view, the guide pattern comprising: sidewalls each elongated in a longitudinal direction and spaced apart from each other, a trench defined by the surface of the substrate as a bottom surface and facing surfaces of the sidewalls, and having a uniform width over an entire length thereof in the longitudinal direction, and a latitudi…
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Classifications
- H10P76/20Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P14/683Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9029271B2 cover?
- A method of patterning a block copolymer layer includes: providing a guide pattern on a surface of a substrate, the guide pattern including sidewalls each elongated in a longitudinal direction and spaced apart from each other, a trench defined by a bottom surface and facing surfaces of the sidewalls, and having a uniform width over an entire length thereof in the longitudinal direction, and a l…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P76/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).