Tungsten deposition on a cobalt surface
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Composite material, method for producing the same, and apparatus for producing the same
US9028982B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9028982-B2 |
| Application number | US-99190209-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 2, 2009 |
| Priority date | Aug 19, 2008 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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- Title
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Abstract
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Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/allocation step wherein the surface of a silicon substrate ( 102 ), which is a matrix provided with a silicon layer at least as the outermost layer, is immersed into a first solution containing gold (Au) ions, so that particulate or island-shaped gold (Au) serving as a first metal and substituted with a part of the silicon layer are dispersed/allocated on the matrix surface, and a plating step wherein the silicon substrate ( 102 ) is immersed into a second solution ( 24 ), which contains a reducing agent to which gold (Au) exhibits catalyst activity and metal ions which can be reduced by the reducing agent, so that the surface of the silicon substrate ( 102 ) is covered with the metal or an alloy of the metal ( 108 ) which is formed by autocatalytic electroless plating using gold (Au) as a starting point.
First claim
Opening claim text (preview).
The invention claimed is: 1. A composite material comprising: a matrix having a silicon layer as an uppermost layer; gold particles on a surface of the matrix in shapes of particles or islands, the gold particles displacing part of the silicon layer; and a metal or an alloy of the metal covering the surface of the matrix, the metal or the alloy of the metal being formed by autocatalytic electroless plating and adhering to the surface with an adhesibility such that the metal o…
Assignees
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Classifications
- H10P14/40Primary
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9028982B2 cover?
- Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/allocation step wherein the surface of a silicon substrate ( 102 ), which is a matrix provided with a silicon layer at least as the …
- Who is the assignee on this patent?
- Yae Shinji, Hirano Tatsuya, Matsuda Hitoshi, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10P14/40. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).