Semiconductor device and manufacturing method thereof
US-2024404870-A1 · Dec 5, 2024 · US
Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process
US9028708B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9028708-B2 |
| Application number | US-201013510514-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 25, 2010 |
| Priority date | Nov 30, 2009 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An aqueous chemical mechanical polishing (CMP) agent (A) comprising solid particles (a1) containing (a11) a corrosion inhibitor for metals, and (a12) a solid material, the said solid particles (a1) being finely dispersed in the aqueous phase; and its use in a process for removing a bulk material layer from the surface of a substrate and planarizing the exposed surface by chemical mechanical polishing until all material residuals are removed from the exposed surface, wherein the CMP agent exhibits at the end of the chemical mechanical polishing, without the addition of supplementary materials, —the same or essentially the same static etch rate (SER) as at its start and a lower material removal rate (MRR) than at its start, —a lower SER than at its start and the same or essentially the same MRR as at its start or—a lower SER and a lower MRR than at its start; such that the CMP agent exhibits a soft landing behavior.
First claim
Opening claim text (preview).
The invention claimed is: 1. An aqueous chemical mechanical polishing agent (A) comprising at least one type of solid particles (a1) finely dispersed in an aqueous phase, wherein the at least one type of solid particles comprise: (a11) a metal corrosion inhibitor, and (a12) at least one solid material selected from the group consisting of a synthetic polymer, a modified naturally occurring polymer, and an unmodified naturally occurring polymer, wherein said synthetic polymer i…
Assignees
Inventors
Classifications
- H10P52/403Primary
Electricity · mapped topic
- H01L21/3212Primary
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9028708B2 cover?
- An aqueous chemical mechanical polishing (CMP) agent (A) comprising solid particles (a1) containing (a11) a corrosion inhibitor for metals, and (a12) a solid material, the said solid particles (a1) being finely dispersed in the aqueous phase; and its use in a process for removing a bulk material layer from the surface of a substrate and planarizing the exposed surface by chemical mechanical pol…
- Who is the assignee on this patent?
- Raman Vijay Immanuel, Li Yuzhuo, Brands Mario, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H10P52/403. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).