Magnetron design for extended target life in radio frequency (RF) plasmas

US9028659B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9028659-B2
Application numberUS-201313961165-A
CountryUS
Kind codeB2
Filing dateAug 7, 2013
Priority dateAug 7, 2012
Publication dateMay 12, 2015
Grant dateMay 12, 2015

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Abstract

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Embodiments of magnetrons suitable to provide extended target life in radio frequency (RF) plasmas are provided. In some embodiments, apparatus and methods are provided to control film uniformity while extending the target life in an RF plasma. In some embodiments, the present invention may facilitate one or more of very high target utilization, more uniform metal ionization, and more uniform deposition on a substrate. In some embodiments, a magnetron may include a magnet support member having a center of rotation; and a plurality of magnetic tracks, each track comprising a pair of open loop magnetic poles parallel to and spaced apart from each other, wherein one track is disposed near the center of the magnet support member, and wherein a different track is disposed in a position corresponding to an outer edge of a target material to be deposited on a substrate when installed in the PVD process chamber.

First claim

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The invention claimed is: 1. A magnetron for use in a process chamber, comprising: a support member having a center of rotation; and a plurality of magnetic tracks coupled to the support member in a fixed orientation, each track comprising a pair of open loop magnetic poles that are parallel to and spaced apart from each other, wherein a length of each magnetic track increases as a distance between each magnetic track and a center of the support member increases.…

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What does patent US9028659B2 cover?
Embodiments of magnetrons suitable to provide extended target life in radio frequency (RF) plasmas are provided. In some embodiments, apparatus and methods are provided to control film uniformity while extending the target life in an RF plasma. In some embodiments, the present invention may facilitate one or more of very high target utilization, more uniform metal ionization, and more uniform d…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification C23C14/35. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).