Method for producing composite material
US-2024052186-A1 · Feb 15, 2024 · US
Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material
US9028582B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9028582-B2 |
| Application number | US-86417109-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2009 |
| Priority date | Jan 23, 2008 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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Abstract
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Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
First claim
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The invention claimed is: 1. A sintered copper-alloy sliding material comprising, by mass percentage, from 0.3 to 15% of In and from 0.5 to 30% of Bi, balance comprising Cu and inevitable impurities, comprising a sintered structure comprising a Cu matrix and a Bi phase consisting of a grain-boundary phase free of In, and being free of an In-concentrated region in the Cu matrix, wherein said sintered copper-alloy sliding material is produced by mixing powder comprising a Cu—In compr…
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Operations & Transport · mapped topic
- C22C1/0425Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Operations & Transport · mapped topic
Mechanical Engineering · mapped topic
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- What does patent US9028582B2 cover?
- Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, an…
- Who is the assignee on this patent?
- Wada Hitoshi, Tomikawa Takashi, Yoshitome Daisuke, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification C22C1/0425. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).