Dense packing particle size distribution for pdc cutters
US-2015375366-A1 · Dec 31, 2015 · US
Polishing composition
US9028574B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9028574-B2 |
| Application number | US-201113878362-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 6, 2011 |
| Priority date | Oct 12, 2010 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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Abstract
Official abstract text for this publication.
A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the width of a base portion of the same protrusion is no less than 0.245. Preferably, the part of the colloidal silica particles that has larger particle diameter than the volume average particle diameter of the colloidal silica particles has an average aspect ratio of no less than 1.15. Preferably, the protrusions on the surfaces of particles belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles have an average height of no less than 3.5 nm.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polishing composition comprising colloidal silica particles each having a surface with a plurality of protrusions, wherein each of the protrusions includes a base portion and a distal portion the distance between which is defined as a height of the protrusion, the base portion having a width, the colloidal silica particles have a volume average particle diameter and include large colloidal silica particles that each have a particle diameter larger th…
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Electricity · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C09K3/1409Primary
Chemistry & Metallurgy · mapped topic
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- What does patent US9028574B2 cover?
- A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the widt…
- Who is the assignee on this patent?
- Ashitaka Keiji, Morinaga Hitoshi, Yasui Akihito, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification C09K3/1409. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).