Wafer dicing from wafer backside and front side
US-9224650-B2 · Dec 29, 2015 · US
US9028340B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9028340-B2 |
| Application number | US-201313828264-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2013 |
| Priority date | Apr 24, 2012 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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Official abstract text for this publication.
This invention provides a method of forming a fine groove with a width smaller than that of a scoreline in a golf club head. The method according to this invention includes a first step of forming a base groove in a face surface as a base of the fine groove, and a second step of forming a recess in at least one side wall of the base groove to reduce the angle between this side wall and the face surface.
Opening claim text (preview).
What is claimed is: 1. A method of forming a fine groove with a width smaller than a width of a scoreline in a golf club head, the method comprising: a first step of forming abuse groove in a face surface as abuse of the fine groove; and a second step of forming a recess in at least one side wall of the base groove to reduce an angle between the one side wall and the face surface by irradiating the at least one side wall and a bottom wall of the base groove with laser beam, wh…
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