Energy Recovery System and Method and Polymerization Plant with Such a Recovery System
US-2015338172-A1 · Nov 26, 2015 · US
Inlet-air-cooling door assembly for an electronics rack
US9025331B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9025331-B2 |
| Application number | US-201213674217-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 12, 2012 |
| Priority date | Nov 12, 2012 |
| Publication date | May 5, 2015 |
| Grant date | May 5, 2015 |
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- Title
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Abstract
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A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.
First claim
Opening claim text (preview).
What is claimed is: 1. A cooling apparatus comprising: a door assembly sized to couple to an electronics rack at an air inlet side of the electronics rack, the door assembly facilitating cooling of airflow into the electronics rack, and thereby, cooling of one or more electronic components of the electronics rack, and wherein the door assembly comprises: at least one airflow opening facilitating passage of airflow through the door assembly and into the electronics rack with the d…
Assignees
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Classifications
Mechanical Engineering · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- F28D15/00Primary
Mechanical Engineering · mapped topic
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Frequently asked questions
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- What does patent US9025331B2 cover?
- A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification F28D15/00. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue May 05 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).