Thin film transistor substrate manufacturing method thereof, display

US9024318B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9024318-B2
Application numberUS-201213722570-A
CountryUS
Kind codeB2
Filing dateDec 20, 2012
Priority dateDec 22, 2011
Publication dateMay 5, 2015
Grant dateMay 5, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

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An embodiment of the invention provides a manufacturing method of a thin film transistor substrate including: sequentially forming a gate electrode, a gate insulating layer covering the gate electrode, an active material layer, and a photo-sensitive material layer on a first substrate; performing a photolithography process by using a half tone mask to form a photo-sensitive protective layer which is above the gate electrode and has a first recess and a second recess; etching the active material layer by using the photo-sensitive protective layer as a mask to form an active layer; removing a portion of the photo-sensitive protective layer at bottoms of the first recess and the second recess to expose a first portion and a second portion of the active layer respectively; forming a first electrode connecting to the first portion; and forming a second electrode connecting to the second portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A thin film transistor substrate, comprising: a first substrate; a gate electrode disposed on the first substrate; a gate insulating layer disposed on the first substrate and covering the gate electrode; an active layer disposed on the gate insulating layer and located above the gate electrode; a photo-sensitive protective layer disposed on the active layer and exposing a first portion and a second portion of the active layer, wherein the first porti…

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What does patent US9024318B2 cover?
An embodiment of the invention provides a manufacturing method of a thin film transistor substrate including: sequentially forming a gate electrode, a gate insulating layer covering the gate electrode, an active material layer, and a photo-sensitive material layer on a first substrate; performing a photolithography process by using a half tone mask to form a photo-sensitive protective layer whi…
Who is the assignee on this patent?
Innocom Tech Shenzhen Co Ltd, Chimei Innolux Corp, Innolux Corp
What technology area does this patent fall under?
Primary CPC classification H10D30/67. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 05 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).