Predictive technique for dispensing product from tractor tool
US-2024045437-A1 · Feb 8, 2024 · US
Methods for processing substrates
US9023716B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9023716-B2 |
| Application number | US-201414147718-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 6, 2014 |
| Priority date | Jan 25, 2013 |
| Publication date | May 5, 2015 |
| Grant date | May 5, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for processing a substrate, the method comprising: providing a bonding layer between the substrate and a carrier to bond the substrate to the carrier; processing the substrate while the substrate is supported by the carrier; and removing the bonding layer to separate the substrate from the carrier, wherein the bonding layer includes a thermosetting release layer and thermosetting glue layers, and wherein at least one of the thermosetting glue…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Human Necessities · mapped topic
- A01G25/09Primary
Human Necessities · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9023716B2 cover?
- A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at leas…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification A01G25/09. Mapped technology areas include Human Necessities.
- When was this patent published?
- Publication date Tue May 05 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).