Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules

US9019779B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9019779-B2
Application numberUS-201314046756-A
CountryUS
Kind codeB2
Filing dateOct 4, 2013
Priority dateMay 8, 2003
Publication dateApr 28, 2015
Grant dateApr 28, 2015

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Abstract

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A layout for simultaneously sub-accessible memory modules is disclosed. In one embodiment, a memory module includes a printed circuit board having a plurality of sectors, each sector being electrically isolated from the other sectors and having a multi-layer structure. At least one memory device is attached to each sector, the memory devices being organized into a plurality of memory ranks. A driver is attached to the printed circuit board and is operatively coupled to the memory ranks. The driver is adapted to be coupled to a memory interface of the computer system. Because the sectors are electrically-isolated from adjacent sectors, the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices on a particular sector may be accessed at one time. In an alternate embodiment, the printed circuit board includes a driver sector electrically isolated from the other sectors and having a multi-layer structure, the driver being attached to the driver sector.

First claim

Opening claim text (preview).

What is claimed: 1. An apparatus comprising: a plurality of memory devices; a printed circuit board having a plurality of sectors, each sector of the plurality of sectors being electrically isolated from other sectors of the plurality of sectors, wherein each sector of the plurality of sectors has a respective at least one of the plurality of memory devices attached thereto; and a plurality of drivers attached to the printed circuit board, wherein each driver of the plurality…

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What does patent US9019779B2 cover?
A layout for simultaneously sub-accessible memory modules is disclosed. In one embodiment, a memory module includes a printed circuit board having a plurality of sectors, each sector being electrically isolated from the other sectors and having a multi-layer structure. At least one memory device is attached to each sector, the memory devices being organized into a plurality of memory ranks. A d…
Who is the assignee on this patent?
Micron Technology Inc
What technology area does this patent fall under?
Primary CPC classification G11C5/02. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).