Circuit boards, methods of fabricating the same, and semiconductor packages including the circuit boards

Patent metadata

Field	Value
Publication number	US-9018752-B2
Application number	US-201313788494-A
Country	US
Kind code	B2
Filing date	Mar 7, 2013
Priority date	Oct 5, 2012
Publication date	Apr 28, 2015
Grant date	Apr 28, 2015

Abstract

Provided is a circuit board, which may include a base layer, an adhesive film, a conductive circuit, and a through via. The adhesive film and the conductive circuit may be provided in plurality to be alternately stacked on the base layer. The through via may be formed through soldering. Since the base layer is not damaged during the soldering, the through via may include various conductive materials. The through via makes it possible to easily connect the conductive circuits having different functions to one another. Accordingly, the circuit board may have multi functions. Thicknesses of the conductive circuits may be adjusted to protect the conductive circuits from folding or bending of the base layer. The circuit board having a multi-layered structure can function not only as a fabric or clothes but also as an electronic circuit.

First claim

What is claimed is:

1. A circuit board comprising:
a base layer;
a first adhesive film on the base layer;
a first conductive circuit on the first adhesive film;
a second adhesive film and a second conductive circuit, which are sequentially stacked on the first conductive circuit; and
a through via passing through the second adhesive film and the second conductive circuit and spaced apart from the base layer,
wherein the first adhesive film comes in contact with the base…

Assignees

• Korea Electronics Telecomm

Inventors

• Kim Ji Eun
• Son Yong Ki
• Kim Baesun
• Cho Il Yeon

Classifications

• H10W90/724

  Electricity · mapped topic

• H10W90/701

  Electricity · mapped topic

• H10W72/241

  Electricity · mapped topic

• H10W72/072

  Electricity · mapped topic

• H10W70/695 Primary

  Electricity · mapped topic