Semiconductor module system having encapsulated through wire interconnect (TWI)

Patent metadata

Field	Value
Publication number	US-9018751-B2
Application number	US-201414257114-A
Country	US
Kind code	B2
Filing date	Apr 21, 2014
Priority date	Apr 24, 2006
Publication date	Apr 28, 2015
Grant date	Apr 28, 2015

Abstract

A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire interconnect includes a via, a wire in the via having a first end bonded to a substrate contact on the semiconductor substrate and a polymer layer at least partially encapsulating the wire. The semiconductor module system can also include a second substrate stacked on the semiconductor substrate having a second through wire interconnect in electrical contact with the through wire interconnect.

First claim

What is claimed is:

1. A semiconductor module system comprising:
a module substrate having an electrode;
a semiconductor substrate on the module substrate having a first side, a second side, a substrate contact on the first side, and an integrated circuit in electrical communication with the substrate contact; and
a through wire interconnect on the semiconductor substrate comprising a via extending through the semiconductor substrate from the first side to the second side ther…

Assignees

• Micron Technology Inc

Inventors

• Hembree David R
• Wood Alan G

Classifications

• H10W72/534

  Electricity · mapped topic

• H10W72/522

  Electricity · mapped topic

• H10W20/0245

  Electricity · mapped topic

• H10W20/0238

  Electricity · mapped topic

• H10W74/00

  Electricity · mapped topic