Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Semiconductor package and manufacturing method thereof
US9018741B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018741-B2 |
| Application number | US-201313739565-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 11, 2013 |
| Priority date | Apr 12, 2012 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor package is presented which has a suitable structure for effectively shielding electromagnetic wave interference (EMI) in a cavity area to which a semiconductor chip is attached. The semiconductor package is assembled such that a lower substrate to which the semiconductor chip is attached is adhered to an EMI shielding & electric I/O body having various types of EMI shielding & electric I/O metal patterns by soldering. Further, the EMI shielding & electric I/O body is adhered to an upper substrate by soldering thereby simplifying assembling of the semiconductor package.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor package comprising: a lower substrate; a semiconductor chip coupled to a cavity area of the lower substrate; an electromagnetic wave interference (EMI) shielding & electric input/output (I/O) body formed to surround the cavity area and coupled to the lower substrate; and an upper substrate coupled to the EMI shielding & electric I/O body, wherein the EMI shielding & electric I/O body comprises: an EMI shielding & electric I/O hole fo…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W42/20Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9018741B2 cover?
- A semiconductor package is presented which has a suitable structure for effectively shielding electromagnetic wave interference (EMI) in a cavity area to which a semiconductor chip is attached. The semiconductor package is assembled such that a lower substrate to which the semiconductor chip is attached is adhered to an EMI shielding & electric I/O body having various types of EMI shielding & e…
- Who is the assignee on this patent?
- Amkor Technology Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).