Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Micro-electro-mechanical-system device with guard ring and method for making same
US9018718B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018718-B2 |
| Application number | US-39161309-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2009 |
| Priority date | Feb 24, 2009 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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- Title
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Abstract
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The present invention discloses a MEMS device with guard ring, and a method for making the MEMS device. The MEMS device comprises a bond pad and a sidewall surrounding and connecting with the bond pad, characterized in that the sidewall forms a guard ring by an etch-resistive material.
First claim
Opening claim text (preview).
What is claimed is: 1. A MEMS device with guard ring, comprising: a substrate including transistor devices, part of interconnection and MEMS structure; a top dielectric layer formed on the substrate, part of the top dielectric layer being etched to release the MEMS device; a top metal layer, part of the top metal layer forming a bond pad; a sidewall on, surrounding and connecting with the bond pad, the sidewall being disposed on and along all sides of the bond pad to extend…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H01L23/585Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9018718B2 cover?
- The present invention discloses a MEMS device with guard ring, and a method for making the MEMS device. The MEMS device comprises a bond pad and a sidewall surrounding and connecting with the bond pad, characterized in that the sidewall forms a guard ring by an etch-resistive material.
- Who is the assignee on this patent?
- Hsu Hsin Hui, Lee Sheng Ta, Wang Chuan Wei, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H01L23/585. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).