Semiconductor device and mounting structure for semiconductor element
US-2024170353-A1 · May 23, 2024 · US
Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof
US9018540B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018540-B2 |
| Application number | US-201313889839-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 8, 2013 |
| Priority date | May 29, 2012 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.
First claim
Opening claim text (preview).
What is claimed is: 1. A wired circuit board, comprising: an insulating layer formed with an opening extending therethrough in a thickness direction of the wired circuit board; a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion; an other-side terminal portion formed on an opposite surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side t…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/0298Primary
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9018540B2 cover?
- A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direct…
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0298. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).