Thermoplastic resin composition having improved impact resistance

US9018312B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9018312-B2
Application numberUS-96501307-A
CountryUS
Kind codeB2
Filing dateDec 27, 2007
Priority dateDec 29, 2006
Publication dateApr 28, 2015
Grant dateApr 28, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A thermoplastic resin composition with improved impact resistance can include (A) about 30 to about 99 parts by weight of an epoxy group-containing styrenic polymer comprising (A 1 ) about 5 to about 100% by weight of an epoxy group-containing vinyl copolymer containing about 0.001 to about 5.0 mol % of an epoxy compound; and (A 2 ) about 0 to about 95% by weight of a rubber modified styrenic copolymer resin; (B) about 1 to about 70 parts by weight of a polyester resin; (C) about 0.001 to about 10 parts by weight of a silicone oil, per 100 parts by weight of a base resin comprising (A) and (B); (D) about 3 to about 20 parts by weight of a bromine-containing flame retardant, per 100 parts by weight of a base resin comprising (A) and (B); and (E) about 0.1 to about 6 parts by weight of a flame retardant aid, per 100 parts by weight of a base resin comprising (A) and (B).

First claim

Opening claim text (preview).

What is claimed is: 1. A thermoplastic resin composition with improved impact resistance comprising: (A) about 50 to about 99 parts by weight of an epoxy group-containing styrenic polymer comprising (A 1 ) about 5 to about 100% by weight of an epoxy group-containing vinyl copolymer comprising about 0.001 to about 5.0 mol % of an epoxy compound; and (A 2 ) greater than 0 to about 95% by weight of a rubber modified styrenic copolymer resin; (B) about 1 to about 50 parts by weight…

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What does patent US9018312B2 cover?
A thermoplastic resin composition with improved impact resistance can include (A) about 30 to about 99 parts by weight of an epoxy group-containing styrenic polymer comprising (A 1 ) about 5 to about 100% by weight of an epoxy group-containing vinyl copolymer containing about 0.001 to about 5.0 mol % of an epoxy compound; and (A 2 ) about 0 to about 95% by weight of a rubber modified styrenic c…
Who is the assignee on this patent?
Son Se Bum, Ahn Sung Hee, Oh In Hwan, and 2 more
What technology area does this patent fall under?
Primary CPC classification C08L55/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).