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Methods for wafer bonding, and for nucleating bonding nanophases
US9018077B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018077-B2 |
| Application number | US-201013259278-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 30, 2010 |
| Priority date | Apr 30, 2009 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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Abstract
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Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly; and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
First claim
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We claim: 1. A method for bonding substrates comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly, wherein the first substrate is a Si wafer and the second substrate is a silicate wafer; and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface consists of O 2…
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Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9018077B2 cover?
- Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly; and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a pol…
- Who is the assignee on this patent?
- Herbots Nicole, Culbertson Robert J, Bradley James, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H10W72/013. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).